We were approached by a major global company to manufacture a custom hermetic power package for a commercial aerospace application. At the time the customer only had a space model and a circuit diagram to define the module required. Working closely with the customer, we were able to design not only the advanced package to meet the requirements, but also the internal circuit layout for the semiconductor die. This 'total' solution enabled the customer to concentrate on their core competencies, i.e. semiconductor engineering and resulted in them achieving a distinct time to market advantage.
We then went on to manufacture this product for them in high volumes and were subsequently invited to continue our successful partnership and work on a new module. This component was in fact a sub-assembly of a plastic module and the package envisaged was to use innovative composite materials such as aluminium MMC in conjunction with alumina/aluminium nitride ceramics etc. Again our expertise in materials technology and manufacturing techniques such as soldering/brazing, welding and plating allowed us to successfully complete the development and cost-effective manufacture of the new module.
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