Requirements for custom packages may involve thermal matching and thermal performance optimisation for high power semiconductor applications. In these cases the use of composite materials such as aluminium silicon carbide , aluminium silicon or copper molybdenum allow the matching of coefficient of thermal expansion rates to the appropriate electronic substrate materials whilst maintaining significantly higher thermal conductivities than more traditional packaging techniques.
High specification ceramics such as Aluminium Nitride, Silicon nitride and Macor are also incorporated into a number of applications.
